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Mold forming epoxy resin APG injection process high temperature curing adhesive

Shanghai Wenyou Industry Co., Ltd.
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Mold forming epoxy resin APG injection process high temperature curing adhesive

Mold forming epoxy resin APG injection process high temperature curing adhesive

Brief Introduction LE-8316L is a modified BPA-type epoxy resin, combined with LH-8316L, a liquid modified carboxylic anhydride hardener. This system is designed for mold forming and APG injection ...

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