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Epoxy Resin with Mold Release Agent for Electrical Insulation

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Epoxy Resin with Mold Release Agent for Electrical Insulation

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Brand Name :	WENYOU
Model Number :	LD605
Price :	$3.40-3.60

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Epoxy Resin with Mold Release Agent for Electrical Insulation

Product Description

LD605 is mainly used as a release agent for epoxy resin products, especially for difficult-to-release, complex mold insulating parts, transformers, high-voltage switches, dry-type transformers, and other epoxy carbon fiber products.

Important performance:

1. Clean, colorless, oil-free, and good adhesion to the surface

2. Easy to operate

3. Will not transfer to

molded products and can improve the appearance of products

4. Air fast curing

5. Keep the mold clean for a long time to reduce the
defective rate

6. It is once again applied to multiple demolding cycles

7. Reduce the accumulation of dirt and mold surface

Specification

How to use release agent:

In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping, and spraying. better. When the solvent is completely evaporated, it can be directly produced.

How to use release agent:

In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the
previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping,
and spraying. better. When the solvent is completely evaporated, it can be directly produced.

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