LW-8128A/LH-8116: UL 94 V-0 Crystal Clear Epoxy Potting Resin for Electronic Connectors | Hand-Pour Application

Product Overview

LW-8128A/LH-8116 is a premium two-component, crystal clear epoxy potting system engineered for hand-pour encapsulation of sensitive electronics. Featuring UL 94 V-0 flame resistance, modified PBA epoxy resin (LW-8128A), and a modified amine hardener (LH-8116), this system delivers exceptional clarity, electrical insulation, and fire safety for electronic connectors, sensors, and micro-transformers. With room-temperature curing and vacuum-compatible processing, it ensures bubble-free protection against moisture, chemicals, and thermal stress.

Key Features & Benefits

Applications

Ideal for encapsulating:

• Electronic connectors (signal, power, PCB headers)

• Miniature transformers and inductors

• Sensor modules and LED arrays

• Insulation bobbins and coil terminals

• Wearable electronics and IoT devices

Technical Specifications

Processing Guide

1. Mixing: Blend LW-8128A resin and LH-8116 hardener at 100:22.5 pbw (default ratio). Add LC-series color paste if required.

2. Degassing: Vacuum degas mixture (recommended for bubble-free clarity).

3. Pouring: Hand-pour or gravity-cast over components.

4. Curing: Cure 24h at 25°C (accelerated curing at 60°C optional).

Why Choose This System?

• Flame Safety: Meets stringent UL 94 V-0 standards for electronics in high-risk environments.

• Ease of Use: Paste consistency simplifies manual application without sagging.

• Optical Clarity: Maintains component visibility for QC inspections.

• Adaptable: Integrates with existing hand-pour or vacuum production lines.